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Mgo Sandwich board

Save up to 60% on utility bills

Require smaller, less costly heating and cooling equipment

Quieter ,draft-free environment

Stronger and more impact resistant in extreme weather conditions

Healthier-resists moisture,mold,rot and insects

Contains and inhibits fire





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Description


Structural Insulated Panel ,also called Mgo SIP and Mgo Sandwich board.It consists of a sandwich of two layers of structural board with an insulation foam in between. Panel skins are magnesium oxide boards. Insulation core can be Expanded Polystyrene(EPS) and Extruded Polystyrene(XPS) and so on.These are structural sheaths that can be finished like drywall on the interior, and covered with siding materials or have stucco applied directly to the exterior of the panel. When the panel is used for basement or foundation walls, foundation spray can be applied directly to the surface.

Advantages


  • FAST construction, with less reliance on highly skilled trades.
  • ELIMINATES framing, insulating, vapour barrier installation and wall cribbing.
  • ENERGY EFFICIENT - Up to 40% heat loss reduction vs stick built. Significant heating and cooling savings. Less temperature fluctuation, less drafty, provides an excellent sound barrier creating a more comfortable living environment.
  • SUPERIOR structural strength to stick built. Performs better under extreme weather conditions - earthquakes, hurricanes, etc. Less material waste and handling. Superior wall strength. No nail pops. Cabinetry and pictures easier to hang.
  • Interior and exterior walls can be finished without additional sheathing - eliminates costly steps and additional materials. Available with wood and grain outside wall finish.

 

Applications:

 

The flexibility of our building system is ideal for many applications including residential, industrial shops and warehouses, Ready to Move buildings and trailers, hotels, factories, aircraft hangars and apartments.


Technical Info.


 

Technical date for
  EPS foam board

Density 

 

Kg/m3

18-20

Thermal conductivity,90 days,10℃

  

W/mk

≤0.04

Compressive strength at 10% deflection
  or  yield,(Vertical)

 

kPa

≥100

Tensile strength

kPa

≥100

Coefficient 
  of  linear  thermal expansion

mm/mk

       ≤0.03

Temperature 
  limits

       ℃

 

-50℃,+75℃

Fire classification

B1

 

Technical data for
  XPS foam board

Density

Kg/m3

36-40

Thermal conductivity,90days,10      

W/mk

      

0.027-0.03

Compressive strength at 10% deflection or
  yield,(Vertical)

kPa

      

 ≤300

Tensile strength

kPa

≤300

Water absorption

Vol-%

≥1.00% n

Capillarity     

nil   

 nil

Coefficient of linear thermal expansion

mm/mk

0.07

Temperature limits

(-50℃,+75℃)

 



 

Specification


1. MGO board thickness: 3-20mm

2. EPS core thickness: 15-250mm

3. XPS core thickness: 15-120mm

4. Max width: 1220mm; Max length: 3660mm

    Standard size 1200*2400mm,1200*2700mm,1200*3000mm.


5. Connection can be Tongue & Groove, Camlock, two or four sides closed.

OCM have design and technical department can design SIP special for you. Just let us know you ideal and we can do the rest.

 

>>Please contact eith OCM salse for get connection solution.



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